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[Case Study] Surface Treatment Using "Sn-Cu Based Lead-Free Solder Reflow"

Achieving cost reduction and quality improvement in surface treatment during parallel production of printed circuit boards both domestically and internationally.

In addition to domestic factories in Japan, we have also expanded our printed circuit board factories overseas, producing the same product range in both domestic and overseas factories while considering product difficulty and pricing. Domestic printed circuit board manufacturers faced cost challenges due to production in overseas factories. For products with a wide variety, there were significant differences in product difficulty. Therefore, relatively low-difficulty products were prioritized for cost-effective production overseas, while high-difficulty products were produced domestically with a focus on quality. As a result, we introduced cost-effective Sn-Cu-based solder for surface treatment overseas. This not only reduced costs from production in overseas factories but also improved overall quality by aligning operations between domestic and overseas facilities. [Case Study] ■ Domestic Printed Circuit Board Manufacturer ■ Introduced Product: Sn-Cu-based Lead-Free Solder Leveler ■ Solder Used: Solder Coat Co., Ltd. LLS-227N *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Soldering Equipment

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[Research] Examination of Copper Etching on Substrates in Lead-Free Solder Reflow

Published results of the investigation into the changes in copper thickness of the substrate during lead-free solder reflow processing.

This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others

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[Information] Guarantee System for Lead-Free Solder

Can you guarantee lead-free solder? I will explain our warranty system in detail.

This document summarizes our efforts regarding the guarantee of lead-free solder. It includes the background for using lead-free solder, as well as information on preventing errors and contamination between eutectic solder products and lead-free solder products. [Contents] ■ What is a solder leveler ■ Background for using lead-free solder ■ Types of lead-free solder ■ Currently available solder levelers ■ The necessity of guarantees for lead-free solder ■ Prevention of errors and contamination between eutectic solder products and lead-free solder products ■ Prevention of contamination in lead-free solder ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others

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Introduction to Basic Knowledge: "Handa Leveler"

Short processing time and inexpensive compared to other plating. Good wettability of solder during assembly.

The "Handa Leveler" is designed to apply a solder coat on the copper surface that forms the land area of printed circuit boards, with the aim of enhancing surface protection and wettability during assembly. The board is immersed in molten solder, and when it is pulled up, high-temperature air is blown from an air knife located above the solder tank to remove excess solder from the board holes, pad surfaces, and resist. This process ensures that only the copper surface is coated with solder. 【Features】 ■ Short processing time allows for high processing capacity ■ Relatively inexpensive ■ Good wettability of solder during assembly ■ High storage stability ■ Reworkable *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts

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Introduction to Basic Knowledge: "Lead-Free Solder Leveler"

Description of features and points to note. *We are currently handling Sn-Cu based products!

"Lead-free solder reflow" refers to the change from conventional solder to lead-free solder. There are many types available, including those that incorporate Bi (bismuth), In (indium), and Al (aluminum). Due to the RoHS directive enacted in 2006, the inclusion of lead in certain products manufactured and sold within the EU has been prohibited, leading to an increase in the transition to lead-free options. 【Features】 ■ Good wetting and through-hole performance ■ Excellent storage stability, making reprocessing easy after aging ■ Minimal variation in surface thickness *For more details, please refer to the PDF materials or feel free to contact us.

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  • Printed Circuit Board

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Lead-free solder leveler

By using commercially available products as much as possible, we can respond smoothly in case of emergencies.

We handle vertical dip-type hot air leveling. We use SUS316 for the dip soldering tank, which is lead-free compliant, and we also use SUS for the exterior and frame, enhancing maintainability and durability. Additionally, by using commercially available products whenever possible, we can respond smoothly to any unforeseen circumstances. A fire damper is also standard equipment. In addition, we have the fully automatic vertical dip-type hot air leveling device "KT-1000." 【Features】 ■ Air heater ■ Hot air nozzle ■ Stirring propeller ■ Air equipment ■ Independent control panel *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Other surface treatment equipment
  • Printed Circuit Board

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